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10500 3 pixel ccd linear sensor (color) description the ILX734LA is a reduction type ccd linear sensor developped for color image scanner, and has shutter function per each color. this sensor reads a4-size documents at a density of 1200 dpi. features number of effective pixels: 31500 pixels (10500 pixels 3) pixel size: 8m 8m (8m pitch) distance between line: 64m (8 lines) single-sided readout ?shutter function ultra low lag/high sensitivity single 12v power supply input clock pulse: cmos 5v drive number of output 3 (r, g, b) package: 56 pin sdip (400 mil) absolute maximum ratings supply voltage v dd 15 v operating temperature ?0 to +55 ? storage temperature ?0 to +80 ? pin configuration (top view) block diagram ?1 e99216-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. ILX734LA 56 pin sdip (cer-dip) driver 33 driver f shut 54 v out-b 50 f 2 7 f 1 23 f 1 26 gnd 25 f rog- r f rs 3 gnd 6 gnd 32 f rog -b 31 f rog -g 34 f 2 5 f lh 53 v dd driver 24 driver f shut 55 v out-g driver shutter drain shutter gate read out gate ccd register red d14 d15 d63 s1 s10500 d64 d83 shutter drain shutter gate read out gate ccd register green d14 d15 d63 s1 s10500 d64 d83 shutter drain shutter gate read out gate ccd register blue d14 d15 d63 s1 s10500 d64 d83 22 driver f shut 2 v out-r 4 35 v dd 1 2 3 4 5 6 7 22 23 24 25 26 27 28 29 30 31 32 33 34 35 50 51 52 53 54 55 56 nc nc v out-r gnd f rs 10500 r 1 10500 g 1 10500 b 1 f lh gnd f 1 f shut -r f 1 f shut -g f rog -r gnd nc nc nc v out-g v out-b v dd nc nc f 2 v dd f 2 f shut -b f rog -b f rog -g nc
? 2 ILX734LA unit pf pf pf pf max. typ. 1600 10 10 10 min. symbol c f 1, c f 2 c f lh c f rs c f rog , c f shut item input capacity of f 1, f 2 input capacity of f lh input capacity of f rs input capacity of f rog, f shut * 1 clock characteristics unit mhz max. 5 typ. 1 min. symbol f f 1, f f 2, f f lh , f f rs item item f 1, f 2, f lh, f rs clock frequency unit v max. 12.6 typ. 12 min. 11.4 item v dd recommended supply voltage unit v v max. 5.25 0.1 typ. 5.0 0 min. 4.75 high level low level f 1, f 2, f lh, f rs, f rog, f shut pulse voltage input clock pulse voltage condition pin description (pins other than below are defined as nc.) * 1 it indicates that f rog -r , f rog -g , f rog -b as f rog, f shut -r , f shut -g , f shut -b as f shut. pin no. symbol description 1 2 3 4 5 6 7 22 23 24 25 26 nc v out-r gnd f rs f lh gnd f 1 f shut -r f 1 f shut -g f rog -r gnd nc signal out (red) gnd clock pulse input clock pulse input gnd clock pulse input clock pulse input clock pulse input clock pulse input clock pulse input gnd pin no. symbol description 31 32 33 34 35 50 51 52 53 54 55 56 f rog -g f rog -b f shut -b f 2 v dd f 2 nc nc v dd v out-b v out-g nc clock pulse input clock pulse input clock pulse input clock pulse input 12v power supply clock pulse input nc nc 12v power supply signal out (blue) signal out (green) nc
? 3 ILX734LA unit % v mv mv % ma % v remarks note 3 note 4 note 8 note 9 max. 2.7 4.3 3.4 20 2.2 5.5 50 typ. 2.0 3.2 2.5 6 3.2 1.6 1 1.28 0.3 1.5 0.02 26 95 250 6.5 10670 min. 1.3 2.1 1.6 2 0.74 0.46 0.58 92 1000 symbol r r r g r b prnu v sat se r se g se b v drk dsnu il i vdd tte zo v os dr item sensitivity nonuniformity saturation output voltage dark voltage average dark signal nonuniformity image lag supply current total transfer efficiency output impedance offset level dynamic range electrooptical characteristics (note 1) (ta = 25 c, v dd = 12v, f f rs = 1mhz, input clock = 5vp-p, light source = 3200k, ir cut filter cm-500s (t = 1.0mm)) notes) 1. in accordance with the given electrooptical characteristics, the black level is defined as the average value of d2, d3 to d12. 2. for the sensitivity test light is applied with a uniform intensity of illumination. 3. prnu is defined as indicated below. ray incidence conditions are the same as for note 2. v out-g = 500mv (typ.) prnu = 100 [%] where the 10500 pixels are divided into blocks of 100. the maximum output of each block is set to v max , the minimum output to v min and the average output to v ave . 4. use below the minimum value of the saturation output voltage. 5. saturation exposure is defined as follows. se = v sat /r where r indicates r r , r g , r b , and se indicates se r , se g , se b . 6. optical signal accumulated time t int stands at 11ms. 7. v out-g = 500mv (typ.) 8. vos is defined as indicated bellow. v out indicates v out-r , v out-g , and v out-b . 9. dynamic range is defined as follows. dr = v sat /v drk when the optical signal accumulated time is shorter, the dynamic range gets wider because the optical signal accumulated time is in proportion to the dark voltage. (v max ?v min )/2 v ave sensitivity saturation exposure red green blue red green blue v/(lx ?s) note 2 lx ?s note 5 note 7 note 6 note 6 v o s v o u t g n d
? 4 ILX734LA 2 1 0 5 0 5 3 4 f r o g f 1 f l h 5 f 2 0 5 f r s 0 v o u t d 1 d 2 d 3 d 1 3 d 1 4 d 1 5 d 6 1 d 6 2 d 6 3 s 1 s 1 0 5 0 0 s 6 4 s 7 1 d 7 2 d 7 3 d 7 8 d 7 9 d 8 3 1 0 5 8 3 o p t i c a l b l a c k ( 4 9 p i x e l s ) d u m m y s i g n a l ( 6 3 p i x e l s ) 1 - l i n e o u t p u t p e r i o d ( 1 0 5 8 3 p i x e l s ) n o t e ) t h e t r a n s f e r p u l s e s ( f 1 , f 2 , f l h ) m u s t h a v e m o r e t h a n 1 0 5 8 3 c y c l e s . v o u t i n d i c a t e s v o u t - r , v o u t - g , v o u t - b . clock timing chart 1
? 5 ILX734LA clock timing chart 2 t 4 t 5 f r o g t 2 t 6 t 7 f 1 f 2 t 1 t 3 clock timing chart 3 f 1 f l h f 2 v o u t t 1 3 t 1 2 t 7 t 6 f r s t 8 t 1 0 t 1 1 t 9
? 6 ILX734LA 2 1 0 5 0 5 3 4 f r o g f 1 f l h 5 f 2 0 5 f r s 0 f s h u t i n t e g r a t i o n t i m e 1 0 5 8 3 clock timing chart 4 (shutter operation) note) shutter pulse must not be low level during from 2 to 10583 of f 1. integration time can be controlled by changing the timing f shut fall.
? 7 ILX734LA clock pulse recommended timing unit ns ns ns ns ns ns ns ns ns ns ns ns ns max. 10 10 60 60 30 30 typ. 100 3000 3000 5 5 20 20 250 * 1 250 * 1 10 10 10 10 min. 50 1200 1200 0 0 0 0 45 45 0 0 symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 item f rog, f 1 pulse timing f rog pulse high level period f rog, f 1 pulse timing f rog pulse rise time f rog pulse fall time f 1 pulse rise time/ f 2 pulse fall time f 1 pulse fall time/ f 2 pulse rise time f rs pulse high level period f rs, f lh pulse timing f rs pulse rise time f rs pulse fall time signal output delay time * 1 these timing data are the recommended condition under f f rs = 1mhz.
? 8 ILX734LA 1 2 3 4 5 6 7 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 5 6 5 5 5 4 5 3 5 2 5 1 5 0 3 5 3 4 3 3 3 2 3 1 3 0 n c 2 w i c 1 i c 1 i c 1 : 7 4 a c 0 4 t r 1 : 2 s c 2 7 8 5 n c v o u t - g v d d v o u t - b n c n c f 2 v d d f 2 f s h u t - b f r o g - b f r o g - g f 2 f r o g - b f r o g - g n c n c n c v o u t - r g n d f r s f l h g n d f 1 f s h u t - r f 1 f s h u t - g f r o g - r g n d n c f s h u t - b 1 0 0 w 2 w f r s f l h 1 0 0 w 1 2 v 4 7 f / 1 6 v 0 . 1 f f 1 f s h u t - g f r o g - r f s h u t - r 5 . 1 k w 1 0 0 w v o u t - b t r 1 5 . 1 k w 1 0 0 w v o u t - g t r 1 5 . 1 k w 1 0 0 w v o u t - r t r 1 application circuit * 1 application circuits shown are typical examples illustrating the operation of the devices. sony cannot assume responsibility fo r any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same . * 1 data rate f f rs = 1mhz. in the case of f f rs = 5mhz, 3 pieces of 74ac04 are recommended to use for f 1 and f 2 driver.
? 9 ILX734LA example of representative characteristics (v dd = 12v, ta = 25 c) s p e c t r a l s e n s i t i v i t y c h a r a c t e r i s t i c s ( s t a n d a r d c h a r a c t e r i s t i c s ) w a v e l e n g t h [ n m ] r e l a t i v e s e n s i t i v i t y 5 5 0 6 0 0 6 5 0 4 0 0 0 0 . 2 0 . 4 0 . 6 0 . 8 1 4 5 0 5 0 0 7 0 0 d a r k s i g n a l o u t p u t t e m p e r a t u r e c h a r a c t e r i s t i c s ( s t a n d a r d c h a r a c t e r i s t i c s ) i n t e g r a t i o n t i m e o u t p u t v o l t a g e c h a r a c t e r i s t i c s ( s t a n d a r d c h a r a c t e r i s t i c s ) t a a m b i e n t t e m p e r a t u r e [ c ] o u t p u t v o l t a g e r a t e 3 0 4 0 5 0 0 0 . 1 0 . 5 1 5 1 0 1 0 2 0 6 0 t i n t i n t e g r a t i o n t i m e [ m s ] o u t p u t v o l t a g e r a t e 5 1 0 . 1 0 . 5 1 1 0 o f f s e t l e v e l v s . t e m p e r a t u r e c h a r a c t e r i s t i c s ( s t a n d a r d c h a r a c t e r i s t i c s ) o f f s e t l e v e l v s . v d d c h a r a c t e r i s t i c s ( s t a n d a r d c h a r a c t e r i s t i c s ) t a a m b i e n t t e m p e r a t u r e [ c ] v o s o f f s e t l e v e l [ v ] 3 0 4 0 5 0 0 0 2 4 6 8 1 0 1 2 1 0 2 0 6 0 d v o s d t a 0 . 5 m v / c v d d [ v ] v o s o f f s e t l e v e l [ v ] 1 2 . 0 1 1 . 4 0 2 4 6 8 1 0 1 2 1 2 . 6 d v o s d v d d 0 . 3 t a = 2 5 c
? 10 ILX734LA notes of handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) notes on handling ccd cer-dip packages the following points should be observed when handling and installing cer-dip packages. a) remain within the following limits when applying static load to the ceramic portion of the package: (1) compressive strength: 39n/surface (do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) shearing strength: 29n/surface (3) tensile strength: 29n/surface (4) torsional strength: 0.9nm b) in addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) be aware that any of the following can cause the glass to crack: because the upper and lower ceramic layers are shielded by low-melting glass, (1) applying repetitive bending stress to the external leads. (2) applying heat to the external leads for an extended period of time with soldering iron. (3) rapid cooling or heating. (4) rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) prying the upper or lower ceramic layers away at a support point of the low-melting glass. note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a grounded 30w soldering iron and solder each pin in less then 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an imaging device, do not use a solder suction equipment. when using an electric desoldering tool, ground the controller. for the control system, use a zero cross type. u p p e r c e r a m i c l a y e r 3 9 n l o w e r c e r a m i c l a y e r l o w - m e l t i n g g l a s s ( 1 ) 2 9 n ( 3 ) 0 . 9 n m ( 4 ) 2 9 n ( 2 )
? 11 ILX734LA 4) dust and dirt protection a) operate in clean environments. b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) exposure to high temperatures or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. 6) ccd image sensors are precise optical equipment that should not be subject to mechanical shocks.
? 12 ILX734LA package outline unit: mm p a c k a g e s t r u c t u r e p a c k a g e m a t e r i a l l e a d t r e a t m e n t l e a d m a t e r i a l p a c k a g e m a s s d r a w i n g n u m b e r c e r - d i p t i n p l a t i n g 4 2 a l l o y l s - e 4 ( e ) 1 . t h e p o i n t a o f t h e p a c k a g e i s t h e h o r i z o n t a l r e f e r e n c e . t h e t w o p o i n t s a ' o f t h e p a c k a g e a r e t h e v e r t i c a l r e f e r e n c e . 2 . t h e h e i g h t f r o m t h e b o t t o m b t o t h e e f f e c t i v e i m a g e a r e a i s 2 . 4 0 . 3 0 m m . 3 . t h e t h i c k n e s s o f t h e c o v e r g l a s s i s 0 . 8 m m , a n d t h e r e f r a c t i v e i n d e x i s 1 . 5 . 4 . t h e n o t c h o f t h e p a c k a g e m u s t n o t b e u s e d f o r r e f e r e n c e o f f i x i n g . 5 6 p i n d i p ( 4 0 0 m i l ) ( a t s t a n d o f f ) 1 1 4 5 6 4 3 1 5 2 8 2 9 4 2 v h 1 0 . 1 6 4 . 0 0 . 5 1 . 2 7 2 9 . 2 1 2 9 . 2 1 0 . 4 6 3 . 6 4 . 4 0 . 5 8 . 8 1 0 . 0 1 . 0 8 4 . 0 ( 8 m x 1 0 5 0 0 p i x e l s ) 1 1 3 . 0 1 . 0 n o . 1 p i x e l ( g r e e n ) 0 . 2 5 1 1 0 . 0 1 5 . 0 0 . 8 5 . 0 0 . 8 5 . 0 9 7 . 0 3 . 0 3 . 0 7 . 0 2 . 0 a 0 ? t o 9 ? a ' a ' ~ ~ ~ b 1 3 . 5 g

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